Amid the rapid advancement of AI computing hardware, next-generation AI servers are imposing stringent demands on XPU chip test sockets—demands for ultra-high bandwidth, miniature form factors, and high-density interconnection. Conventional connector solutions struggle to reconcile high-speed signal integrity with compact mechanical constraints. Leveraging its proprietary Micro Pogo technology, Top-link has completed the dedicated development of a 224Gbps XPU Socket, delivering a reliable domestic high-speed interconnect solution for high-end computing hardware. This newly developed Micro Pogo high-speed socket employs PAM4 modulation with a fundamental frequency of 56 GHz to support 224 Gbps signal transmission, while maintaining tight control of characteristic impedance at 85±5% Ohm. Across the 0–56 GHz frequency range, insertion loss is kept within −0.5 dB, return loss exceeds −15 dB, near-end crosstalk remains below −35 dB, and both far-end crosstalk and differential-to-common-mode conversion are held under −40 dB. The design effectively suppresses ultra-high-frequency resonance and ensures stable, intact high-speed signal transmission. Precision mechanical optimization has been applied throughout: the working height is 1.85 mm with a total compression stroke of 0.6 mm, and contact force stabilizes at 25 gf under operating conditions. Pin pitch is set at 1.0 mm, with both signal and ground pins featuring an outer diameter under 0.5 mm. This ultra-miniaturized design resolves the inherent trade-off between compression stroke and spring force within ultra-thin enclosures. A custom-designed test PCB is provided, fully compatible with RF probes and high-speed board-to-board connectors, enabling comprehensive validation of high-frequency electrical performance. From precision micro-pin manufacturing and barrel swaging to end-to-end high-speed simulation and physical performance validation, Top-link has established a complete development chain for Micro Pogo—from initial design to production-ready implementation. Targeting next-generation AI computing hardware, Top-link continues to advance high-density, high-speed interconnect technologies, driving technical upgrades across domestic high-end chip testing and AI server hardware industries.
