Driven by rapid advancements in AI computing hardware, high‑speed modules and ultra‑thin electronics, connectors are required to deliver smaller form factors, higher density and superior high‑speed performance. Conventional pogo pins can hardly satisfy miniaturized applications such as XPU Socket and high‑density board‑to‑board connections.Developed by Top‑Link, Micro Pogo miniature spring‑loaded connectors offer reliable solutions for high‑density, high‑speed interconnections.
As an upgraded miniaturized variant of standard pogo pins, Micro Pogo (mini spring pin) is engineered for ultra‑compact, high‑density and low‑profile applications. It consists of three core components: barrel, miniature spring and plunger. Leveraging Top‑link’s precision crimping and closing processes, the connector achieves significant size reduction. Internal springs provide stable contact force to ensure robust electrical contact between plungers and mating interfaces. It enables consistent high‑speed signal transmission while reducing overall stack height and PCB footprint, supporting end‑device miniaturization and compact design.
Top‑Link Micro Pogo features two proven configurations: double‑ended pin and single‑ended pin for diverse use‑cases.
The double‑ended pin targets chip‑to‑board (XPU Socket) and board‑to‑board interconnections. With dual‑sided spring contact and stub‑free design, it eliminates signal interference. Fine pitch down to 0.35 mm is supported. At a working height of 1.85 mm, it provides up to 0.6 mm compression travel. It maintains ample travel at low profile to guarantee reliable spring contact and suppress high‑frequency resonance, ideal for XPU Socket, high‑speed backplanes and module‑to‑board high‑speed applications. The single‑ended pin is optimized for cable interconnection. Its tail solder‑mount design supports cable termination. Featuring stub‑free architecture and 0.35 mm minimum pitch, it delivers 0.4 mm compression travel at 1.6 mm working height, balancing miniaturization and contact tolerance. It fits cable‑to‑PCB interconnections and high‑speed test probes.
Key specifications include minimum 0.2 mm pin diameter, pitch options below 0.5 mm and 0.5‑1.2 mm, with working height starting from 1.6 mm, well suited for next‑gen hardware miniaturization.
From AI chip sockets and high‑speed board interconnections to high‑speed test probes, Top‑Link Micro Pogo addresses critical pain‑points of high‑density miniature interconnection with precision manufacturing capabilities, empowering customers’ hardware innovation.
