Driven by rapid advancements in AI computing hardware, high‑speed modules and ultra‑thin electronics, connectors are required to deliver smaller form factors, higher density and superior high‑speed performance. Conventional pogo pins can hardly satisfy miniaturized applications such as XPU Socket and high‑density board‑to‑board connections.Developed by Top‑Link, Micro Pogo miniature spring‑loaded connectors offer reliable solutions for high‑density,[…..]
Recent Posts
Top‑Link Micro Pogo: High‑Speed Interconnect for AI Servers
August 14, 2026
Top‑Link Shines at electronica China 2026
August 05, 2026
