On July 1, electronica China 2026 opened at the Shanghai New International Expo Centre, gathering over 1,900 global exhibitors.
Top‑Link’s booth W2‑312 quickly became a highlight with the debut of its Micro Pogo and next‑gen high‑speed interconnects. Designed for ultra‑compact, high‑density spaces, Micro Pogo delivers stable signal transmission in a tiny footprint, freeing up PCB space for advanced applications like GPU sockets. A national high‑tech and “Little Giant” enterprise, Top‑Link brings over 20 years of expertise in signal integrity, high‑reliability connections, and micro‑nano manufacturing.
On day one, professionals from AI, semiconductors, and automotive electronics crowded the booth, engaging with Top‑Link’s team. The conversation has just begun – we’re at W2‑312 for two more days, ready to shape the future of high‑speed interconnects with partners across the AI supply chain.
