On July 1, electronica China 2026 opened at the Shanghai New International Expo Centre, gathering over 1,900 global exhibitors. Top‑Link’s booth W2‑312 quickly became a highlight with the debut of its Micro Pogo and next‑gen high‑speed interconnects. Designed for ultra‑compact, high‑density spaces, Micro Pogo delivers stable signal transmission in a tiny footprint, freeing up PCB[…..]
Against the backdrop of rapid advances in AI chips, 5G communications and high-performance computing in 2026, test probes — critical precision components in semiconductor testing — have garnered growing attention across the industry. From smartphones to AI accelerators, every chip undergoes rigorous inspection by test probes before mass production. With the growing adoption of advanced[…..]
Recent Posts
Top‑Link Micro Pogo: High‑Speed Interconnect for AI Servers
August 14, 2026
Top‑Link Shines at electronica China 2026
August 05, 2026
