As AI computing continues to advance, Co-Packaged Optics (CPO) is emerging as a key solution to overcome bandwidth and power challenges in next-generation data centers. By integrating optical engines and ASICs within a compact package, CPO places greater demands on interconnect density, form factor, and signal integrity. As data rates advance toward 224 Gbps and 448 Gbps, impedance control, contact reliability, insertion loss, and crosstalk become increasingly critical.
Micro Pogo technology provides a compact, compliant interconnect solution for CPO architectures, enabling high-speed electrical connections between optical engines, chips, package substrates, and PCBs, depending on the system design. It offers flexible solutions for CPO interconnect and optical engine interconnect applications. Its miniature form factor and precision spacing support high-density packaging, while its spring-loaded contacts accommodate assembly tolerances and mechanical movement. Combined with optimized impedance and structural design, Micro Pogo helps maintain reliable electrical connections and signal integrity.
Unlike conventional soldered interconnects, Micro Pogo can support detachable connections in appropriately designed configurations. This enables easier testing, module replacement, and maintenance, offering greater flexibility in CPO assembly and manufacturing.
With extensive expertise in high-speed precision interconnects, Top-Link develops Micro Pogo solutions tailored to the needs of CPO and NPO architectures. Through continuous optimization of structural design, materials, and contact performance, Top-Link delivers customized solutions for high-density integration, signal integrity, and connection reliability—supporting engineers in optical modules, AI computing hardware, and advanced packaging.