Semiconductor
Test Probe Solutions
Test probes × test sockets × test fixtures — one-stop custom development covering the complete chip-test flow from wafer CP probing to final FT, high-temperature burn-in and high-frequency testing, supporting high-speed interconnect test requirements up to 224 Gbps in validated R&D configurations*.
* Subject to product design and test conditions; final values per official datasheets.
Built for Precision Test Interconnect
National “Little Giant” Enterprise
A National High-Tech and National Specialized & Sophisticated “Little Giant” company — a total-solution provider of precision probes and test sockets.
In-House Simulation Lab
SI simulation for impedance matching, insertion loss and crosstalk — high-frequency probe and socket combinations validated before hardware is built.
Probe + Socket + Fixture
Probe, socket and fixture structure developed as one system — or supplied separately to match your existing fixture platform.
Shorter Fixture Lead Time
Covering the full chip-manufacturing test spectrum with one-stop custom development — cutting the delivery cycle of test fixtures.
From Wafer CP to High-Frequency AI Chip Test
Covering chip-manufacturing test scenarios end to end, with one-stop custom development of probes, sockets and fixture structures.
Wafer CP Probing Solution
For 8″/12″ wafer probing: miniature Pogo Pin probe arrays and probe-card interconnect modules solve unstable contact and short life on high-density-pad wafers. The core product is the IC Test Probe, with tip geometry customized to pad size and pitch — for memory and logic wafer lines.
Package FT Final-Test Solution
For functional testing of BGA/QFN/DFN/SOP packages: standardized and custom IC test sockets with Pogo probes, compatible with ATE automated test equipment for stable, high-throughput production contact.
High-Temperature Burn-In Solution
Supports long-duration powered soak at 120–180 °C: high-temperature specialty probes and thermally insulated sockets solve spring-force decay and contact-resistance drift at heat — essential for power-semiconductor and memory burn-in.
High-Frequency AI Chip Test Solution
For GPUs, AI compute chips and RF millimeter-wave chips: SI-simulation-driven impedance-matched design delivers shielded test probes and high-frequency sockets with low signal attenuation, safeguarding signal integrity at speed.
The Complete Chip-Test Flow
From first silicon to mass production — every stage of the test flow has a matched interconnect product. Combine them into one verified channel, or pick exactly the stage you need.
Probe Card
Wafer sort & CP screening
Test Socket
Package final test (FT)
Burn-In Socket
Reliability verification
Test Board
Board-level validation
SI Simulation Before Hardware
High-frequency scenarios live or die on impedance matching, insertion loss and crosstalk. Shielded structures, low-loss materials and short signal paths are designed in — and confirmed by SI simulation before any probe is machined.
Chip Domains We Serve
AI Compute
High-density test-point interconnect for GPU / Chiplet devices.
Memory
Wafer and final-test support for expanding memory production lines.
Power Semiconductors
High-temperature burn-in for IGBT / SiC / GaN devices.
RF Chips
Signal integrity for millimeter-wave and high-speed interfaces.
Consumer SoC
Mass-production testing of phone and terminal main-control chips.
Automotive
Wide-temperature reliability and burn-in verification testing.
Frequently Asked Questions
Can we order probes only, without a full fixture?
Yes. Probes, test sockets and fixture structures can be custom-developed as a whole — or supplied separately; we match probe specifications to your existing fixture platform.
What does the solution-design process look like?
Provide package specifications and test requirements → engineers evaluate and deliver a selection proposal with quotation → drawing confirmation and sampling → on-machine sample validation → pilot run → mass production. A package spec is all we need for a free proposal and quotation.
Probes keep failing in high-temperature burn-in — what can be done?
Spring-force decay and contact-resistance drift are the dominant failure modes at heat. We use high-temperature probe materials and oxidation-resistant plating combined with insulated socket structures, then verify against your actual soak temperature and duration.
What special requirements does high-frequency testing place on probes?
Impedance matching, insertion loss and crosstalk: shielded structures, low-loss materials and short signal paths are essential. We recommend confirming the probe-and-socket combination through SI simulation.
What about lead time and minimum order quantity?
Sampling cycles, MOQ and production lead times are confirmed per commercial agreement — submit your requirements through the contact page for a quotation.
How do we start the conversation?
Submit your package specifications and test requirements through the contact page, or reach us directly — our engineers will respond with simulation results, a proposal and a quotation after evaluation.
Get Your Custom Chip-Test Solution
Send us a package spec — get a free simulation, proposal and quotation. National “Little Giant” enterprise, total-solution provider for precision probes and test sockets.
Submit Test Requirements