Driven by the growing bandwidth demand of AI computing, optical-electrical interconnection is critical for high-speed signal transmission.
CPO and NPO are two widely discussed new architectures in this field. CPO, short for Co-Packaged Optics, integrates optical engines together with switch chips or ASICs in the same package or adjacent zone to minimize transmission path.NPO stands for Near-Packaged Optics. It also locates optical engines close to the chip for optimized signal links, while co-packaging is not a mandatory requirement. Both architectures are designed for next-generation high-speed optical-electrical interconnection for AI infrastructure.
They differ in integration and packaging form, and both are key target applications for our Micro Pogo high-speed interconnect solutions.