Micro Pogo
High-Density Spring Connector
A miniaturized spring-loaded precision connector engineered for ultra-compact, high-density, and ultra-thin applications — delivering reliable electrical contact with stable force for XPU sockets, board-to-board, high-speed backplanes, and test probes.
What is Micro Pogo?
Micro Pogo is a miniaturized upgrade of the standard Pogo Pin — also known as a micro spring pin or mini pogo pin. It is a precision spring-loaded connector engineered specifically for ultra-compact, high-density, and ultra-thin applications.
Composed of three core components — a tube, a spring, and a plunger — Micro Pogo achieves significant size reduction through precision machining and crimping. The internal spring delivers stable normal force, establishing a reliable electrical connection between the plunger and the mating component.
While ensuring stable signal transmission, it reduces overall product thickness and supports high-density array layouts — enabling slimmer, more compact end products. It is increasingly deployed in XPU sockets, board-to-board / module-to-board connections, high-speed backplanes, and high-speed test probes — wherever density and data rate converge.
Compared with stamped spring contacts, Micro Pogo holds an inherent structural advantage, making it better suited for the industry's future direction: higher density, lower loss, and higher bandwidth.
Three-Part Construction
Engineered for High-Density, High-Speed
Every design element is optimized for the demanding conditions of next-generation interconnect.
Ultra-Fine Pitch
Minimum pitch down to 0.35 mm, enabling ultra-high-density array layouts for XPU sockets and advanced packaging.
Stub-Free Design
Eliminates signal stubs that cause reflections and resonance, preserving signal integrity at multi-gigabit data rates.
Long Compression Stroke
Up to 0.6 mm stroke at a 1.85 mm working height — absorbs thermal warpage and tolerance stack-up reliably.
High-Frequency Resonance Suppression
Optimized cavity geometry suppresses electromagnetic resonance at ultra-high frequencies — critical for dense XPU sockets.
Corrosion-Resistant Plating
Composite coating technology delivers enhanced resistance to sweat, salt spray, and aggressive environmental conditions.
Double- & Single-Ended
Two contact architectures available — double-ended for chip-to-board, single-ended with wire-solder tail for cable assemblies.
Two Configurations, One Platform
Choose the contact architecture that matches your interconnect topology.
Double-Ended Pin
Chip-to-Board / Board-to-Board
- Contact StructureDouble-ended spring-loaded
- Free Height2.4 mm
- Working Height1.8 mm
- Total Length @ Work1.85 mm
- Compression StrokeUp to 0.6 mm
- Minimum Pitch0.35 mm
- Stub-Free Yes
Single Pin
Cable / Wire Interconnect
- Contact StructureTail-end wire soldering
- Free Height2.4 mm
- Working Height2.1 mm
- Total Length @ Work1.6 mm
- Compression StrokeUp to 0.4 mm
- Minimum Pitch0.35 mm
- Stub-Free Yes
Micro Pogo vs. Stamped Spring Contacts
In AI server high-speed interconnects, both are elastic contact options — but Micro Pogo's structural advantages point to the future.
| Parameter | Micro Pogo | Stamped Spring |
|---|---|---|
| Free Height | 2.4 mm | 2.4 mm |
| Working Height | 1.8 mm (lower profile) | 2.1 mm |
| Compression Stroke | Up to 0.6 mm (double-ended) | Limited by flat-spring geometry |
| Minimum Pitch | 0.35 mm | Coarser pitch constraints |
| Stub-Free Design | Yes | Stubs common |
| High-Frequency Resonance | Suppressed | Prone to cavity resonance |
| Contact Force Stability | Spring-driven, consistent | Variable over compression range |
| Scalability to Higher Density | Excellent | Limited |
| Future Direction (Density / Loss / Bandwidth) | Aligned | Reaching limits |
Verified High-Speed Performance
Full-process SI simulation validated across key high-frequency parameters.
Characteristic Impedance
Insertion Loss (IL)
Return Loss (RL)
Near-End Crosstalk (NEXT)
Far-End Crosstalk (FEXT)
Diff-to-Common Mode Conv.
224Gbps XPU Socket — Self-Developed
A dedicated Micro Pogo-based socket engineered for next-generation AI server high-speed interconnect.
Industry Pain Points
Top-Link Solution
Where Micro Pogo Delivers Value
From AI compute to semiconductor test — high-density, high-speed scenarios across the industry.
XPU Sockets
Chip-to-board ultra-short interconnect for AI accelerators
Board-to-Board
Module-to-board and board-to-board high-density connections
High-Speed Backplanes
Orthogonal backplane and mid-range server interconnect
Test Probes
High-speed semiconductor ATE test sockets and probes
AI Server High-Speed Interconnect — Three Main Technical Paths
High-Speed Orthogonal Backplane
Mid-range board-to-board interconnect within the server chassis. Micro Pogo enables higher density and lower loss vs. PCB traces.
CPC + High-Speed Cables
Chip-to-chip short-haul using DAC/ACC copper cables. Single-pin variant with wire-solder tail ideal for cable assemblies.
XPU Socket Micro-Interconnect
Ultra-short chip-to-board with minimal signal loss. Double-ended Micro Pogo is the contact of choice for 224Gbps XPU sockets.
Backed by Full-Process Capability
From simulation to volume production — a self-contained R&D and manufacturing system.
SI Simulation
Full-process signal integrity simulation covering link impedance, insertion loss, return loss, crosstalk, and mode conversion. Built on Micro Pogo technology with rapid prototyping capability.
Mechanical Simulation
Full-process mechanical validation covering contact stress, compression stroke, insertion durability, thermal deformation, and crimping analysis — addressing the large-stroke vs. fine-pitch trade-off.
Corrosion-Resistant Plating
Systematic coating development for sweat, salt spray, and aggressive environments. Composite plating technology delivers enhanced corrosion resistance with full-process verification.
ISO/IEC 17025 Accredited Lab
In-house laboratory with comprehensive mechanical, electrical, environmental, and eco reliability testing for Micro Pogo and Pogo pin connectors. Over 95% of test items completed internally.
Patent Portfolio
233 authorized patents (including 36 invention patents) and 60 pending invention patents. Nearly 20 core patents focus on high-frequency high-speed connectors, Micro Pogo, and resonance suppression.
Mass Production Capacity
Annual production capacity exceeding 10 billion units. Systematic lean management drives an integrated process from R&D to mass production, ensuring batch-stable, high-performance delivery.
Ready to Integrate Micro Pogo?
Contact our engineering team for custom design support, samples, and volume pricing. From prototype to 10-billion-unit scale — we deliver batch-stable, high-performance interconnect solutions.
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