High-Speed Interconnect for
Next-Generation AI Servers
Proprietary Micro Pogo technology powering three mainstream AI server interconnect architectures — XPU Socket, High-Speed Orthogonal Backplane, and CPC + High-Speed Cable. Engineered for 224Gbps data rates, ultra-fine pitch down to 0.35mm, and signal integrity verified to 112GHz.
The Three Pillars of AI Server High-Speed Interconnect
AI server hardware relies on three mainstream high-speed interconnect architectures to move massive volumes of data between XPUs, boards, and modules. Each path has distinct signal-loss characteristics — and Top-Link's Micro Pogo technology is engineered to address the unique challenges of all three.
XPU Chip
High-power AI accelerator
XPU Socket
Ultra-short chip-to-board
PCB / Backplane
Board-to-board mid-range
CPC + Cable
Chip-to-chip short-haul
Three Interconnect Paths, One Micro Pogo Foundation
From ultra-short chip-to-board links to mid-range board-to-board backplanes, Top-Link delivers purpose-built Micro Pogo solutions for every critical interconnect point in the AI server.
XPU Socket Micro-Interconnect
Enables ultra-short chip-to-board interconnection with minimal signal loss due to extremely short trace length — ideally suited for high-frequency signaling in next-gen AI accelerators.
- Pitch down to 0.35mm fine-pitch arrays
- ≥0.5mm dynamic compression stroke
- Withstands XPU thermal warpage
- Stub-free design suppresses resonance
- Target: 224Gbps per lane
High-Speed Orthogonal Backplane
Enables mid-range board-to-board interconnection within the server chassis. Micro Pogo contacts reduce the physical loss penalty inherent in rigid PCB backplane traces at high frequencies.
- Double-ended spring-loaded contacts
- 0.6mm compression at 1.85mm height
- High-frequency resonance suppression
- Dense orthogonal pin field arrays
- SI verified to 112GHz
CPC + High-Speed Cable
Enables chip-to-chip short-haul interconnection using DAC (direct-attach copper) or ACC (active copper) cables to replace PCB traces, effectively reducing high-frequency attenuation.
- Tail-end wire-solder structure
- 0.4mm stroke at 1.6mm total height
- Stub-free high-speed design
- Compatible with DAC / ACC cables
- Low insertion loss architecture
What is Micro Pogo?
Micro Pogo is a miniaturized upgrade of the standard Pogo Pin — also known as micro spring pin or mini pogo pin. It is a precision spring-loaded connector engineered for ultra-compact, high-density, and ultra-thin applications.
Composed of a tube, spring, and plunger, Micro Pogo achieves significant size reduction through precision machining and crimping. The spring delivers stable contact force to establish a reliable electrical connection between the plunger and the mating component — while reducing product thickness and supporting high-density layouts.
Three-Part Precision Construction
Plunger (Needle Tip)
The contact surface that mates with the target component. Precision-machined for consistent contact force and low resistance.
Spring
Provides stable, calibrated normal force across the compression stroke. Engineered for long-cycle durability and consistent electrical performance.
Tube (Barrel)
Houses the spring and plunger through precision crimping. Enables ultra-low profile while maintaining structural integrity and signal path.
Key advantage: While ensuring stable signal transmission, Micro Pogo reduces product thickness and satisfies high-density demands — enabling slimmer, more compact end products.
Micro Pogo vs. Stamped Spring Contacts
In AI server high-speed interconnects, stamped springs and Micro Pogo are the two main elastic contact choices. Micro Pogo holds an inherent structural advantage — better suited for future demands of higher density, lower loss, and higher bandwidth.
| Parameter | Micro Pogo Recommended | Stamped Spring |
|---|---|---|
| Free Height | 2.4 mm | 2.4 mm |
| Working Height | 1.8 mm | 2.1 mm |
| Profile Thinness | Ultra-thin, 0.3mm lower | Thicker profile |
| Fine Pitch Capability | Down to 0.35mm | Limited by stamping |
| High-Frequency Resonance | Stub-free, suppressed | Higher resonance risk |
| Compression Stroke | Long stroke at low height | Shorter effective stroke |
| Density Scalability | High-density arrays | Density-limited |
| Signal Integrity @ High Speed | Excellent (SI-verified) | Degrades at high freq |
| Best For | 224Gbps AI server interconnect | Low-speed / low-density apps |
Micro Pogo Product Series for AI Servers
Two core contact architectures — double-ended and single-ended — plus a dedicated 224Gbps XPU Socket platform, each optimized for specific interconnect roles in the AI server.
Micro Pogo Dual Contact
XPU Socket & Board-to-Board
Key benefit: Large compression stroke at low working height ensures reliable elastic contact while suppressing high-frequency resonance points. Ideal for XPU substrate-to-PCB and board-to-board connections.
Micro Pogo Cable Contact
CPC + High-Speed Cable
Key benefit: Tail-end wire-soldering structure enables direct integration with high-speed cable assemblies (DAC/ACC). Ultra-compact 1.6mm profile with reliable 0.4mm stroke for chip-to-chip short-haul links.
224Gbps XPU Socket
Next-Gen AI Accelerator
Industry pain points solved: Extreme fine-pitch causing electromagnetic cavity resonance; thermal warpage from high-power XPUs; maintaining ≥0.5mm dynamic stroke at ultra-low installation heights. Purpose-built for next-generation AI server high-speed interconnect.
SI-Verified Performance at Millimeter-Wave Frequencies
Every Micro Pogo high-speed product undergoes full-process signal integrity simulation. Key high-frequency parameters are validated against industry specifications — ensuring reliable 224Gbps-class transmission.
Characteristic Impedance
Insertion Loss (IL)
Return Loss (RL)
Near-End Crosstalk (NEXT)
Far-End Crosstalk (FEXT)
Diff-to-Common Mode Conv.
End-to-End Capabilities from R&D to Mass Production
A fully self-controlled R&D and manufacturing system — from signal integrity simulation to precision machining, electroplating, and ISO/IEC 17025 accredited testing. 95%+ of test items completed in-house.
Patent Portfolio
233+ authorized patents (36 invention), 60 pending invention patents. ~20 core patents focus on high-frequency connectors, Micro Pogo, and resonance suppression.
SI Simulation
Full-process signal integrity simulation covering impedance, insertion/return loss, crosstalk, and mode conversion for dense multi-signal high-speed transmission.
Mechanical Simulation
Full-process mechanical validation covering contact stress, compression stroke, insertion durability, thermal deformation, and crimping analysis.
ISO/IEC 17025 Lab
Accredited laboratory with comprehensive mechanical, electrical, environmental, and eco testing. 95%+ test items completed in-house with world-leading instruments.
Mass Manufacturing
Annual production capacity exceeding 10 billion Micro Pogo units. Fully integrated precision machining, electroplating, and assembly with systematic lean management.
Global Certifications
ISO 9001, IATF 16949, ISO 13485, UL, ISO 14001. National High-Tech Enterprise and "Little Giant" company.
Corrosion-Resistant Coatings
Systematic coating development including composite plating technologies. Enhanced sweat and salt-spray corrosion resistance for demanding environments.
Customized One-Stop Service
Demand-driven innovation with "manufacturing-savvy R&D" and "product-savvy manufacturing." Customized, highly adaptable solutions from concept to production.
Where Micro Pogo Powers AI Infrastructure
From the chip package to the rack-level interconnect, Micro Pogo technology enables reliable high-speed signaling across the entire AI server architecture.
XPU / GPU Socket
Ultra-short reach chip-to-board interconnect for AI accelerators, handling thermal warpage and extreme fine-pitch arrays.
Orthogonal Backplane
Mid-range board-to-board connections in high-density server chassis with reduced high-frequency signal loss.
CPC Cable Assemblies
Chip-to-chip short-haul links using DAC/ACC copper cables, replacing PCB traces for lower attenuation.
Semiconductor Test Probes
High-speed test and measurement interfaces requiring precision contact, high cycle life, and signal fidelity.
Frequently Asked Questions
Micro Pogo is a miniaturized spring-loaded pin connector engineered for ultra-compact, high-density, high-speed applications. In AI servers it is used in XPU sockets, board-to-board connections, high-speed backplanes, and cable assemblies — enabling reliable electrical contact at fine pitches down to 0.35mm with excellent signal integrity up to 112GHz and data rates targeting 224Gbps.
The three mainstream paths are: (1) High-Speed Orthogonal Backplane for mid-range board-to-board interconnection within the chassis, (2) CPC + High-Speed Cables (DAC/ACC copper) for chip-to-chip short-haul links, and (3) XPU Socket Micro-Interconnect for ultra-short chip-to-board connections. Top-Link's Micro Pogo technology addresses all three architectures with purpose-built products.
Top-Link's self-developed Micro Pogo products target 224Gbps XPU Socket applications. SI simulation-verified performance includes insertion loss ≤ -0.5dB up to 61GHz, return loss ≤ -18.5dB up to 66.5GHz, and crosstalk ≤ -40dB up to 60GHz — all meeting or exceeding industry specifications for next-generation high-speed interconnect.
Top-Link is a fully integrated design-to-manufacturing company. We operate in-house R&D, precision machining, electroplating, assembly, and an ISO/IEC 17025 accredited laboratory — with an annual production capacity exceeding 10 billion Micro Pogo units. We are a National High-Tech Enterprise and "Little Giant" company.
Yes. Top-Link offers customized, highly adaptable one-stop services driven by customer demand. Our "manufacturing-savvy product development" and "product-savvy precision manufacturing" capabilities enable rapid iteration from SI simulation to mass production. We work closely with customers to solve specific interconnect challenges including ultra-fine pitch, thermal warpage, and high-frequency resonance.
Ready to Engineer Your Next-Gen AI Server Interconnect?
Contact our engineering team for customized Micro Pogo solutions, sample requests, and technical consultation. From SI simulation to mass production, we deliver high-performance, batch-stable connectivity.